HEATSINK New Material Technology Co., Ltd.

HEATSINK e ipabola ka thepa ea ho teba ha mocheso, e le mofani oa tharollo ea amohelehang ea ho senya mocheso oa microchips le ho paka, ke k'hamphani e phahameng ea theknoloji e kopanyang R & D, tlhahiso le electroplating ea thepa e tsoetseng pele, 'me boleng ba lihlahisoa tsa rona bo fihlile boemong bo ka sehloohong ba machaba.