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WCu Laser Bars

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WCu Laser Bars

Among existing heat-sink technologies, pin-fin heat sinks represent an efficient cooling solution. They have a large surface area in relation to any other heat-sink volume. In addition, pin-fin heat sinks are made of highly thermally conductive aluminum alloys or copper. Pin-fin heat sinks consist of a base and an array of embedded pins. Parameters such as base-plate dimensions (both footprint and thickness), pin length, thickness and density, and material (aluminum, copper or others) fit most specifications. As a result, pin fins can easily be customized to fit various applications depending on heat loads involved, available space, and airflow.

We design and manufacture Pin-Fin base plates for the power electronics industry. These base plates offer the most efficient heat transfer available today due to our forging, machining, plating and surface treatment technology.

    Product Advantages:

    Reliable material quality: The WCu alloy we produce is almost completely compact, which is essential for thermal conductivity, stability of the CTE, as well as dimensional accuracy of appearance, reduction of surface and plating defects.

    High machining accuracy: perpendicularity 90±0.5° or 0.01 mm, flatness 0.005 mm, surface finish Ra0.1 μm, dimensional tolerance±0.01 mm. With our unique processing technology, the surface machining grooves are not visible even under the high-power microscope.

    Reliable plating quality: There are two typical nickel and gold plating layers. (1) Nickel 1 μm + gold 0.3 μm. After nickel plating, there is no heat treatment, and gold plating is carried out directly. (2) Nickel 2-4 μm + Gold 0.5 μm. Nickel plating at the base is 1 μm, heat treatment is applied in hydrogen atmosphere at 800 °C for 10 min, and then nickel plating is thickened to about 3 μm, and gold plating is 0.5 μm. The thickness of the nickel and gold layers can be adjusted to meet the needs of customers. We can also provide quality services of selective spot gold/tin plating.


    Material options and properties


    Material

    Mass percent composition

    Density

    Thermal Conductivity

    CTE

    With

    IN

    g/cm3

    w/m.k

    10-6/K

    W93Cu7

    7±1

    Balance

    17.6

    150-170

    6.0

    W90Cu10

    10±1

    Balance

    17.0

    180-190

    6.5

    W85Cu15

    15±1

    Balance

    16.4

    190-200

    7.0