HEATSINK Group ga-egosipụta na 2023 ọgụgụ isi Radar Conference na Shenzhen

Otu HEATSINK ga-egosipụta na 3rd Modern Radar Forum - Ọgụgụ isi nke Radar Technology Development Conference, nke akwadoro na October 27-28, 2023 na Shenzhen Pingshan Yanzihu International Convention and Exhibition Center. N'ebe ahụ, anyị ga-ewebata thermal ngwọta na heatspreaders.

Ụbọchị: Ọktoba 27-28, 2023

Ebe: Shenzhen Pingshan Yanzihu International Convention and Exhibition Center

Ụlọ #: A-100

Isi ihe ngosi:

1.Tungsten-ọla kọpa heatspreaders

2. Molybdenum-ọla kọpa heatspreaders

3. CMC (Cu/Mo/Cu)

4.CPC (Cu/MoCu/Cu)

5. Ihe mejupụtara diamond-Cu/Al/Ag

6. Akụkụ ndị a na-emepụta nke ọma

Anyị nwere ike ike nke stamping, forging na machining, nwere ike na-emepụta stamping akụkụ na Kovar, ọla kọpa ma ọ bụ aluminum, nakwa dị ka stamping, forging na nkenke machining akụkụ na ọla kọpa, aluminum, Kovar, Invar, ọla kọpa / Kovar / ọla kọpa, ọla kọpa / Invar. / ọla kọpa na ihe ndị ọzọ maka 5G / microelectronic nkwakọ.