E hōʻike ʻo HEATSINK Group ma 2023 Intelligent Radar Conference ma Shenzhen

E hōʻike ʻo HEATSINK Group i ka 3rd Modern Radar Forum - Intelligent Radar Technology Development Conference, i hoʻonohonoho ʻia ma ʻOkakopa 27-28, 2023 ma Shenzhen Pingshan Yanzihu International Convention and Exhibition Center. Ma laila mākou e hoʻolauna ai i nā hoʻonā wela me nā heatspreaders.

･Nā lā: ʻOkakopa 27-28, 2023

･Wāhi: Shenzhen Pingshan Yanzihu International Convention and Exhibition Center

･Booth#: A-100

Nā Hōʻike Nui:

1.Tungsten-copper heatspreaders

2. Molybdenum-keleawe heatspreaders

3. CMC (Cu/Mo/Cu)

4.CPC (Cu/MoCu/Cu)

5. Nā Hui Daimana-Cu/Al/Ag

6. Nā ʻāpana mīkini pololei

Loaʻa iā mākou nā mana ikaika o ka stamping, forging a me ka mīkini, hiki ke hana i nā ʻāpana stamping ma Kovar, keleawe a aluminika paha, a me ka stamping, forging a me nā ʻāpana mīkini pololei i ke keleawe, aluminika, Kovar, Invar, keleawe / Kovar / keleawe, keleawe / Invar / keleawe a me nā mea ʻē aʻe no ka 5G/microelectronic packaging.