ʻO ke kaula uea tungsten he ʻelua kiʻekiʻe a me ka ikaika kiʻekiʻe, hoʻohana nui ʻia i ka hana ʻana i nā ingots monocrystalline silicon maʻemaʻe kiʻekiʻe.

Loaʻa i ka Tungsten ka maikaʻi o ka helu heheʻe kiʻekiʻe a me ka ikaika kiʻekiʻe, ʻoiai ʻo ke keleawe ka mea maikaʻi o ka conductivity thermal kiʻekiʻe a me ka hana kuʻi maikaʻi. No laila, ʻo nā composites me nā pono o nā mea ʻelua he koi nui no ka ikaika kiʻekiʻe a me ka conductivity thermal i nā koi o ka hui kiʻekiʻe a paʻakikī o nā hanana hanana.

Hiki ke hoʻohana ʻia nā composites Tungsten-copper i ka paia mua o nā mea hoʻoheheʻe thermonuclear fusion a me nā ʻāpana kānana bias, ka wili ikaika ikaika a me nā ʻāpana wili arc.

Loaʻa i ka Xingyao New Material ka ʻike a me ka ʻenehana i ka hoʻomākaukau ʻana i nā composites tungsten-copper kiʻekiʻe.

Hāʻawi ka Nano alumina i ka ikaika o ka wela a me ka paʻakikī, ʻaʻole ia e hōʻemi nui i ka conductivity o ka alloy, i mea e hana maikaʻi ai ka mea a puni, ʻoi aku ka 1000 ℃ ʻaʻole hiki ke hoʻololi i kāna hana, nā ʻāina ʻē i kapa ʻia ʻo "Super. keleawe".

Ma muli o ka hoʻopuehu ʻana o ka alumini oxide i loko o ka matrix keleawe i ke anawaena o nā nanometer wale nō, a ʻoi aku ka liʻiliʻi o ka pākēneka maʻiʻo, no laila ka dispersion o ke keleawe me ke keleawe maʻemaʻe a me nā mea keleawe ʻē aʻe e like me ka uila a me ka thermal conductivity.

He pipiʻi ka metala Rhenium a ʻaʻole hoʻohana wale ʻia, a hoʻohana nui ʻia ia i mea hoʻohui e hoʻomaikaʻi ai i ke kūpaʻa ʻana o nā alloys wela kiʻekiʻe.

Tungsten heavy alloys (WHAs) ua puka mai e like me ka mea o ke koho no na noi i loko o nāʻano hoʻolālā 'āpana ma muli o ko lakou mau mea kū hoʻokahi, e like me ke kiʻekiʻe kiʻekiʻe, kiʻekiʻe ikaika, kiʻekiʻe hopena ikaika a me ka corrosion kū'ē, etc. Commonly, Ni based binders Hoʻohana ʻia ʻo Ni–Fe, Ni–Cu, etc. no ka hoʻohui ʻana i nā WHA.

ʻO ka molybdenum-copper alloy he pseudo alloy, molybdenum a me ke keleawe ʻaʻole hiki ke hoʻopili ʻia, hoʻohui piha i ka conductivity thermal kiʻekiʻe, kiʻekiʻe melting point a me ka coefficient haʻahaʻa o ka hoʻonui wela o ka molybdenum me ka conductivity thermal kiʻekiʻe o ke keleawe. Hiki ke hoʻololi ʻia ka lakio o ka molybdenum me ke keleawe, MoxCuy, x+y=100. ʻO ka papa ma lalo nei kekahi o nā māka maʻamau. Hiki i ka molybdenum-copper alloy o Xingyao New Material ke hoʻokō kokoke loa i ka ʻeleʻele, kīnā ʻole, hui maikaʻi, helium mass spectrometer leakage mea ʻike lewa

Ke hoʻohālikelike ʻia me ke keleawe tungsten, ʻoi aku ka haʻahaʻa o ka molybdenum copper density, ʻoi aku ka maikaʻi o ka rollability, kūpono no ka hana ʻana i nā huahana ʻili lahilahi; a hiki i ka molybdenum copper ke stamping, kūpono no nā ʻāpana hana kiʻekiʻe, haʻahaʻa haʻahaʻa. Hoʻohana nui ʻia no nā electrodes, nā mea sweating.

ʻO Tungsten-copper alloy kahi ʻano pseudo alloy, tungsten a me ke keleawe i immiscible, hoʻohui piha i ka conductivity thermal kiʻekiʻe, kiʻekiʻe hoʻoheheʻe kiʻekiʻe, haʻahaʻa haʻahaʻa haʻahaʻa hoʻonui hoʻonui o tungsten me ke kiʻekiʻe thermal conductivity o ke keleawe. Hiki ke hoʻololi ʻia ka lakio o ka tungsten a me ke keleawe, WxCuy, x+y=100. Hiki i ka tungsten-copper alloy o Xingyao New Material ke hoʻokō kokoke loa i ka ʻeleʻele, kīnā ʻole, ka hui palaoa maikaʻi, a me ka ʻike leakage o ka mea e ka helium mass spectrometry he ea

ʻO nā paipu hoʻoluʻu wai, nā kukini wela, nā microchannels, pūʻolo

Kovar/SiAl/Invar/Cu/Al/ODS-Cu/CIC/CKC, etc.

Ma waena o nā ʻenehana wela i kēia manawa, hōʻike ʻia nā wela wela pin-fin i kahi hopena hoʻomaha maikaʻi. He ʻāpana ili nui ko lākou e pili ana i kekahi puʻupuʻu wela ʻē aʻe. Eia kekahi, hana ʻia nā ʻāpana wela pin-fin me nā alumini alumini thermally conductive a i ʻole keleawe. He kumu a me kahi ʻano o nā pine i hoʻokomo ʻia. ʻO nā ʻāpana e like me ka nui o ka pā papa (ʻo ka wāwae a me ka mānoanoa), ka lōʻihi o ka pine, ka mānoanoa a me ka nui, a me nā mea (alumini, keleawe a i ʻole nā ​​​​mea ʻē aʻe) kūpono i ka hapa nui o nā kikoʻī. ʻO ka hopena, hiki ke maʻalahi ka hoʻopili ʻana i nā ʻili pin e kūpono i nā noi like ʻole e pili ana i nā haʻahaʻa wela e pili ana, nā wahi i loaʻa, a me ka ea.

Hoʻolālā a hana mākou i nā papa kumu Pin-Fin no ka ʻoihana uila uila. Hāʻawi kēia mau papa kumu i ka hoʻoili wela maikaʻi loa i loaʻa i kēia lā ma muli o kā mākou forging, machining, plating a me ka ʻenehana lapaʻau ʻili.

Hiki ke hoʻohana ʻia nā mea hoʻohui keleawe/daimana e like me nā mea hoʻoheheʻe wela o ka hanauna e hiki mai ana i nā ʻenehana uila holomua, a ʻo ia ke kumu o ka TC kiʻekiʻe loa a hiki i ka 2200 W/(m・K) ma ke ʻano; hiki ke hoʻopili ʻia ka CTE o nā mea hui keleawe/diamania e pili kokoke i nā mea ʻāpana semiconductor chip (4-6 ppm/K); hiki i ka TC o Cu-diamond composites ke hiki i 500–900 W/(m・K) ; a paʻa ka composite i ka mahana ambient a loaʻa iā ia ka isotropic TC, ʻaʻole i kaupalena i kāna mau noi ākea.

Ua like ʻo Diamond-Al me Diamond-Cu, me ka liʻiliʻi liʻiliʻi a me ka liʻiliʻi o ka hoʻonui wela.

ʻO Ag (Silver) he kiʻekiʻe ka wela ma mua o ke keleawe, ʻo ia ka mea me ka hoʻoili wela wela kiʻekiʻe ma waena o nā metala. Hoʻopili ʻia kēia Ag a me ka pauka daimana e kā mākou ʻenehana ponoʻī e hana maikaʻi i kahi mea hou me ka conductivity thermal o 600 W/(m・K) a i ʻole.

ʻO Al-Si alloy kahi mea hoʻoheheʻe a hoʻolei ʻia i ka mea nui i haku ʻia me ka alumini a me ke silika. ʻO ka maʻamau, ʻo 11% ka ʻike silika, a ua hoʻohui ʻia kahi liʻiliʻi o ke keleawe, ka hao, a me ka nickel e hoʻomaikaʻi i ka ikaika. Hoʻohana nui ʻia ʻo AI-Si alloy i ka ʻoihana kaʻa a me ka ʻoihana mīkini hana e hana i kekahi mau ʻāpana ma lalo o nā kūlana friction sliding ma muli o kona māmā māmā, maikaʻi thermal conductivity, kekahi ikaika, paʻakikī, a me ka pale ʻana i ka corrosion. Hoʻohana nui ʻia ka Al-Si alloy i ka mokulele, ka halihali, ke kūkulu ʻana, a me nā ʻoihana koʻikoʻi ʻē aʻe.

Hoʻohana ʻia ʻo Al-SiC MMC ma nā ʻano ʻano like ʻole e like me ka aerospace, nā mokulele, ka lalo o ka wai, kaʻa, substrate i ka uila, kolepa kolepa, turbine blades, brake pads a me nā mea ʻē aʻe. Ma waena o nā ʻano hana like ʻole, he maʻalahi ke ala hoʻoheheʻe ʻana, ʻoi aku ka uku, a hoʻohana ʻia no ka hana nui.

ʻO ka huila Mo-Cu hoʻi he pseudo alloy, molybdenum a me ke keleawe i immiscible, e hui pū ana i ka conductivity thermal kiʻekiʻe, kahi hoʻoheheʻe kiʻekiʻe, CTE haʻahaʻa o ka molybdenum a me ka conductivity thermal kiʻekiʻe o ke keleawe.

Hiki i kā mākou molybdenum copper alloy ke hoʻokō kokoke i ka compactness, ʻaʻohe kīnā, ka ʻano palaoa maikaʻi, ka ea

ʻO ka tungsten copper alloy he pseudo alloy, tungsten a me ke keleawe ʻaʻole miscible, hoʻohui piha i ka conductivity thermal kiʻekiʻe, kahi heheʻe kiʻekiʻe, haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa o ka tungsten a me nā hiʻohiʻona kiʻekiʻe thermal conductivity o ke keleawe.

Hiki i kā mākou tungsten copper alloy ke hoʻokō kokoke i ka compactness, ʻaʻohe kīnā, ka ʻano palaoa maikaʻi, ka ea