Mo-Cu alloy is also a pseudo alloy, molybdenum and copper are immiscible, fully combining the high thermal conductivity, high melting point, low CTE of molybdenum and the high thermal conductivity of copper. Compared with WCu, it has lower density and better rollability, which is suitable for the production of thin strip products; it can be stamped, suitable for high-volume, low-cost production of parts. It is mainly used for electrodes and sweating materials.
The composition of Mo and Cu can be adjusted, MoxWithand,x+y=100.
Ourmolybdenumcopper alloy can achieve almost complete compactness, no defects, fine grain structure, airtightness -9Pa/m3.s (with helium leak detection mass spectrometer), comparable to any first-class products in the world.