MPCF-Cu/Al

Diamond copper/aluminum/silver is the heat dissipation material with the best comprehensive performance at present, but it is extremely difficult to machine, and can only be processed by laser, plasma cutting and diamond grinding wheel grinding, which leads to its extremely high cost and difficult mass production. Mesophase asphalt-based carbon fiber (MPCF) has a thermal conductivity of up to 1120W/m.K. At present, the thermal conductivity of MPCF available has been close to 900W/m.K, and the research and development of composite materials with aluminum and copper alloys has become a reality. The thermal conductivity of high-orientation pyrolytic graphite HOPG pyrolytic graphite can reach 1600-2000W/m.K, and its composite materials with copper and aluminum are also the research and development direction.

Carbon fiber copper, carbon fiber aluminum, carbon copper, carbon aluminum have good processing performance, excellent thermal conductivity, and have the potential to replace diamond copper and diamond aluminum, and are widely used in microelectronic packaging, optoelectronic packaging, laser diodes, insulated gate bipolar transistors (IGBT), power semiconductors, heat sinks, cover plates, etc.