Diamond-Cu/Al/Ag Composites

Copper/diamond composites have the potential to be used as the next-generation heat sink materials in advanced electronic devices, and this is because the diamond has the highest TC up to 2200 W/(m・K) in nature; the CTE of copper/diamond composites could be tailored to be close to that of semiconductor chip materials (4–6 ppm/K); the TC of Cu-diamond composites could reach 500–900 W/(m・K) ; and the composite is stable at ambient temperature and has isotropic TC, which doesn’t limit its wide applications.

Diamond-Al is similar to Diamond-Cu, with less density and less thermal expansion.

Ag (Silver) having a higher thermal conductivity than Copper, is the material with the highest thermal conductivity among metals. This Ag and diamond powder are mixed and sintered by our own technology to successfully produce a new material with thermal conductivity of 600 W/(m・K) or more.