Diamond-Cu/Al/Ag Composites

Imixube yobhedu/yedayimani inamandla okusetyenziswa njengesizukulwana esilandelayo semathiriyeli yokucwilisa ubushushu kwizixhobo zombane eziphambili, kwaye oku kungenxa yokuba idayimani ineyona TC iphezulu ukuya kuthi ga kwi-2200 W/(m · K) kwindalo; i-CTE yobhedu/i-diamond composites inokwenziwa ukuze ibe kufutshane naleyo ye-semiconductor chip imathiriyeli (4–6 ppm/K); i-TC ye-Cu-diamond composites inokufikelela kuma-500–900 W/(m・K) ; kwaye i-composite izinzile kubushushu be-ambient kwaye ine-isotropic TC, engathinteli usetyenziso lwayo olubanzi.

I-Diamond-Al ifana ne-Diamond-Cu, enoxinano oluncinci kunye nokwandiswa okuncinci kwe-thermal.

I-Ag (iSilivere) ene-thermal conductivity ephezulu kuneCopper, yimpahla eneyona conductivity iphakamileyo ye-thermal phakathi kwesinyithi. Le Ag kunye nomgubo wedayimane zixutywe kwaye zifakwe kwitekhnoloji yethu ukuvelisa ngempumelelo imathiriyeli entsha ene-thermal conductivity ye-600 W/(m・K) okanye ngaphezulu.