I-Diamond-Cu/Al/Ag Composites

Inhlanganisela yethusi/yedayimane inamandla okusetshenziswa njengesizukulwane esilandelayo sezinto zokucwilisa ukushisa kumishini kagesi ethuthukisiwe, futhi lokhu kungenxa yokuthi idayimane line-TC ephakeme kakhulu efika ku-2200 W/(m・K) ngokwemvelo; i-CTE yenhlanganisela yethusi/yedayimane ingase ihlanganiswe ukuze isondelane naleyo yezinto zokwakha ze-semiconductor chip (4–6 ppm/K); i-TC yezinhlanganisela ze-Cu-diamond ingafinyelela ku-500–900 W/(m・K) ; futhi inhlanganisela izinzile ezingeni lokushisa elizungezile futhi ine-isotropic TC, engakhawuleli ukusetshenziswa kwayo okubanzi.

I-Diamond-Al ifana ne-Diamond-Cu, inokuminyana okuncane nokunwebeka okushisayo okuncane.

I-Ag (Isiliva) ene-thermal conductivity ephakeme kune-Copper, iyinto ene-thermal conductivity ephakeme kakhulu phakathi kwezinsimbi. Le mpushana ye-Ag nedayimane ixutshwa futhi ifakwe emshinini wobuchwepheshe ukuze kukhiqizwe ngempumelelo into entsha ene-thermal conductivity engu-600 W/(m・K) noma ngaphezulu.