Diamond-Cu/Al/Ag Composites

Metsoako ea koporo / daemane e na le monyetla oa ho sebelisoa e le lisebelisoa tsa ho thella mocheso lisebelisoa tse tsoetseng pele tsa elektroniki, 'me sena ke hobane daemane e na le TC e phahameng ka ho fetisisa ho fihla ho 2200 W/(m・K) ka tlhaho; CTE ea metsoako ea koporo / litaemane e ka etsoa hore e be haufi le ea lisebelisoa tsa semiconductor chip (4–6 ppm/K); TC ea metsoako ea Cu-diamond e ka fihla ho 500–900 W/(m・K); 'me motsoako o tsitsitse mochesong oa tikoloho' me o na le isotropic TC, e sa lekanyetseng lits'ebetso tsa eona tse pharaletseng.

Diamond-Al e ts'oana le Diamond-Cu, e nang le boima bo fokolang le katoloso e fokolang ea mocheso.

Ag (Silver) e nang le conductivity e phahameng ea mocheso ho feta Copper, ke thepa e nang le mocheso o phahameng ka ho fetisisa oa mocheso har'a tšepe. Phofo ena ea Ag le daemane e tsoakoa le ho silafatsoa ke theknoloji ea rona ho hlahisa thepa e ncha ka katleho e nang le mocheso oa mocheso oa 600 W/(m ・ K) kapa ho feta.