Lehae
Liphihlello tsa histori Redao & Fengtai ha u habanya mahlo feela
Tlhahiso ea bona e ka sehloohong e shebana le li-module tsa IGBT tsa mocheso oa koporo pin fin board / flat plate, likarolo tse hatisitsoeng tsa Kovar, likarolo tsa setempe sa koporo le likarolo tsa aluminium. Ka matla a matla a ho hatakela, ho forging & machining, lihlahisoa tsa rona li sebelisoa haholo ho paka lisebelisoa tsa motlakase, antenna ea setsi sa 5G, radiator ea IGBT le lisebelisoa tse ling tsa motlakase.
Redao (e bolelang "Thermal Conduction" ka Sechaena): fektheri e akaretsa sebaka sa 28,000 m².
Fengtai (e bolelang "Mollo le Khotso" ka Sechaena): lithupelo li nka sebaka sa fatše sa 3500 m2.
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28000 + Sebaka sa Feme -
3500 + Sebaka sa lithupelo -
54 Setifikeiti -
30 Y Phihlelo
HEATSINK e ipabola ka thepa ea ho teba ha mocheso, e le mofani oa tharollo ea amohelehang ea ho senya mocheso oa microchips le ho paka, ke k'hamphani e phahameng ea theknoloji e kopanyang R & D, tlhahiso le electroplating ea thepa e tsoetseng pele, 'me boleng ba lihlahisoa tsa rona bo fihlile boemong bo ka sehloohong ba machaba. Lihlahisoa tsa rona tsa boleng bo holimo tse phahameng tsa taolo ea mocheso oa li-microelectronic li koahela mefuta eohle, e sebelisoang haholo ho microwave, maqhubu a seea-le-moea, infrared, laser, potoloho e kopantsoeng le masimo a mang. Maitemogelo a rona a masomesome a dingwaga mo tlhagisong le mo thekenolojing a re thusa go fitlhelela ditlhokafalo tse di tlhomameng tsa moreki wa rona le go tlhagisa dikuno tse di dirilweng ka tsela ya maemo a a kwa godimo.
Motheong oa semela se seng se ntse se le teng, semela se secha sa 80,000 m2 se se se qala ho sebetsa ho tloha ka Loetse 2023, haufinyane re tla ba fektheri e kholo ka ho fetisisa ea li-heaters tsa mocheso oa microelectronic & semiconductor packaging heat sink materials le likarolo tse ling lefatšeng.