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With Diamondis an innovative new material developed by HEATSINK New Material Technology Co., Ltd. This leading company specializes in providing advanced heat dissipation solutions for various industries, and Cu-Diamond is a step forward in terms of performance and efficiency, This new technology combines the excellent properties of diamond with the high thermal conductivity of copper, thus obtaining a high-performance heat dissipation material. Cu-Diamond offers a thermal conductivity of up to 4,000 W/mK, making it the most efficient heat dissipation material available on the market, Given that thermal efficiency is a major concern in the electronics industry and other systems that produce a significant amount of heat, the use of Cu-Diamond can help improve heat dissipation and prevent overheating, Cu-Diamond is easy to use and can be tailored to meet the specific requirements of each application. This material can be used in various configurations such as motherboards, radiators, heat pipes and more, Cu-Diamond from HEATSINK New Material Technology Co., Ltd. is the perfect choice to improve thermal efficiency and ensure reliable and safe operation of your system.