Cu/MoCu/Cu
Features:
- It has a higher thermal conductivity than copper/molybdenum/copper materials.
- It can be stamped into parts to reduce the cost.
- It has strong interfacial bonding, that can withstand repeated impacts at 850℃.
- It has a designable coefficient of thermal expansion, compatible with semiconductors and ceramics.
- It is non-magnetic.
Applications:
- Thermal mounting plates
- Chip carriers for microwave components
- Flanges and frames for RF and laser diode packages, LED packages,
- BGA packages and GaAs device mounts etc.