Cu/Mo/Cu – efficient connection solutions for the electronics industry

HEATSINK New Material Technology Co., Ltd. is the leader in manufacturing and providing innovative solutions in the field of new materials for heat dissipation. One of the most promising and innovative products we offer is based on Cu/Mo/Cu lamination technology. As heat dissipation is a key issue in many applications, our solutions with integrated thermal printing and advanced Cu lamination technology /Mo/Cu, provides exceptional heat dissipation performance. This means that our Cu/Mo/Cu heatsinks are able to conduct heat with superior efficiency, thus preventing overheating and keeping devices and equipment in optimal working condition, Our Cu/Mo/Cu products are designed to adapt to the requirements specifications of each customer and can be used in a wide range of applications, including electronics, automotive, telecommunications and more, Based on advanced scientific research and extensive experience in the field, HEATSINK New Material Technology Co., Ltd. is the ideal partner in finding innovative thermal solutions for your needs. We assure you of the superior quality of our products and the continuous support we offer to our customers