Efficient and stable GaN diode products - providing the best power conversion efficiency

Graphite silicon-based composite heat sink is an innovative product of HEATSINK New Material Technology Co., Ltd., specially designed for the heat dissipation needs of high-power semiconductor electronic equipment. This product uses advanced graphite silicon-based material and combines GAN diode technology with excellent heat dissipation performance and excellent thermal conductivity. , graphite silicon-based composite heat sink has excellent thermal conductivity and heat dissipation properties, which can effectively reduce the temperature of electronic equipment and improve the stability and reliability of the equipment. This heat sink has high thermal conductivity and low thermal resistance, which can quickly dissipate the heat generated by electronic equipment to ensure the normal operation of the equipment. , In addition, the graphite silicon-based composite heat sink has excellent high temperature resistance and long-term stability, can continue to operate in extreme working environments, and is not easy to deform or break. Its unique design makes it more suitable for the cooling needs of high-power electronic equipment. , HEATSINK New Material Technology Co., Ltd. is committed to developing innovative heat dissipation products and providing customers with high-performance heat dissipation solutions. Graphite silicon-based composite heat sink is one of our core products. Our professional team will customize heat dissipation solutions for customers to meet the heat dissipation needs of various high-power electronic equipment.