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We are pleased to introduce our new product Si-Al refractory material from HEATSINK New Material Technology Co., Ltd. This innovative material is considered the ideal solution to thermal cooling problems in many industries. The Si-Al material is distinguished by its superior ability to dissipate heat effectively and quickly. It uses conduction technology between the chips and different thermal parts in order to provide better airflow and temperature control. It is also resistant to corrosion and shock, providing maximum safety and sustainability in various applications. Si-Al has exceeded all expectations in multiple fields such as electronic, medical, IT, automotive and more. It improves the efficiency of cooling devices and prevents malfunctions and damage associated with excessive heat. The new Si-Al product is the latest innovation from HEATSINK New Material Technology Co., Ltd. Which will contribute significantly to enhancing the performance of your devices and enabling them to operate at their maximum capacity in optimal operating conditions. Invest in this cutting-edge heat technology and be sure to provide high performance and stability to your products and devices