HEATSINK

E pili ana iā mākou

Nā hana mōʻaukala ʻO Redao & Fengtai i ka nānā

ʻO kā lākou hana nui e pili ana i nā modules IGBT heat dissipation copper pin fin board / flat plate, Kovar stamped parts, copper stamped parts and aluminum parts. Me nā mana ikaika o ka stamping, forging & machining, hoʻohana nui ʻia kā mākou huahana i ka ʻeke uila uila, 5G base station antenna, IGBT radiator a me nā uila uila ʻē aʻe.

ʻO Redao (ʻo ia hoʻi "Thermal Conduction" ma ka ʻōlelo Kina): uhi ka hale hana i kahi ʻāpana o 28,000 m².
Fengtai (ʻo ia hoʻi "Ke ahi a me ka maluhia" ma ka ʻōlelo Kina): noho nā hale hana i kahi papahele o 3500 m2.

He ʻoi aku ka maikaʻi o HEATSINK i nā mea wela, ma ke ʻano he mea hāʻawi i ka hoʻonā ʻana o ka microchips heat dissipation a me ka hoʻopili ʻana, he hui ʻenehana kiʻekiʻe e hoʻohui ana i ka R&D, ka hana ʻana a me ka electroplating o nā mea holomua, a ua hōʻea ka maikaʻi o kā mākou huahana i ka pae alakaʻi honua. ʻO kā mākou huahana hoʻokele wela microelectronic kiʻekiʻe kiʻekiʻe e uhi i ka laulā holoʻokoʻa, hoʻohana nui ʻia i ka microwave, radio frequency, infrared, laser, integrated circuit a me nā kahua ʻē aʻe. ʻO kā mākou mau makahiki o ka ʻike i ka hana ʻana a me ka ʻenehana e hiki ai iā mākou ke hoʻokō i nā koi pololei o kā mākou mea kūʻai aku a hana i nā huahana i hana ʻia i ka maikaʻi loa.

Ma ke kumu o kahi mea kanu i kēia manawa, ke hoʻomaka nei kahi mea kanu hou o 80,000 m2 mai Kepakemapa 2023, i ka wā e hiki mai ana e lilo mākou i hale hana nui loa o nā microelectronic heat spreaders & semiconductor packaging heat sink material a me nā ʻāpana o ka honua.