Ekhaya
Impumelelo yembali Redao & Fengtai ngokujonga nje
Imveliso yabo ephambili igxile kwiimodyuli ze-IGBT zokutshatyalaliswa kobushushu be-copper pin fin board / i-flat plate, i-Kovar stamped parts, i-copper stamped parts kunye ne-aluminiyam. Ngobuchule obunamandla bokunyathela, ukubumba kunye nokwenza, iimveliso zethu zisetyenziswa ngokubanzi kwipakethe yesixhobo samandla, i-antenna yesiseko se-5G yesikhululo, irediyetha ye-IGBT kunye nezinye izixhobo zombane.
I-Redao (ithetha "i-Thermal Conduction" ngesiTshayina): umzi-mveliso ugubungela indawo eyi-28,000 m².
I-Fengtai (ithetha "uMlilo noXolo" ngesiTshayina): iindibano zocweyo zihlala kwindawo yomgangatho we-3500 m2.
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28000 + Indawo yoMzimveliso -
3500 + Indawo yeendibano zocweyo -
54 Isatifikethi -
30 Y Amava
I-HEATSINK igqwesa kwizinto zokutshisa ubushushu, njengomboneleli wesisombululo esaziwayo se-microchips ukutshatyalaliswa kobushushu kunye nokupakishwa, yinkampani ephezulu yobuchwepheshe edibanisa i-R & D, ukuvelisa kunye ne-electroplating yezinto eziphambili, kwaye umgangatho weemveliso zethu ufikelele kwinqanaba elihamba phambili lamazwe ngamazwe. Iimveliso zethu ezikumgangatho ophezulu ezikumgangatho ophezulu zokulawula ubushushu be-microelectronic zigubungela lonke uluhlu, olusetyenziswa ngokubanzi kwi-microwave, ifrikhwensi yerediyo, i-infrared, i-laser, isekethe edibeneyo kunye nezinye iinkalo. Amashumi eminyaka amava ethu kwimveliso nakwitekhnoloji isenza sikwazi ukuhlangabezana neemfuno ezichanekileyo zomthengi wethu kwaye sivelise iimveliso ezenziwe ngomthungo ezikumgangatho ophezulu.
Ngokwesiseko sesityalo esele sikhona, isityalo esitsha se-80,000 m2 ngoku siqalisa ukusebenza ukususela ngoSeptemba ka-2023, kwikamva elingekude siza kuba ngowona mzi-mveliso mkhulu we-microelectronic heat spreaders & semiconductor ukupakisha imathiriyeli yokucwilisa ubushushu kunye neenxalenye zehlabathi.