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NGWA MBELATA OKPOMỌKỤ
Gbasara anyị

Ụgwọ nke ụlọ ọrụ Heatsink New Material Technology Co., Ltd.
Ọkachamara na ikpo ọkụ ọkụ & ihe nkwakọ ngwaahịa maka ngwaọrụ microelectronic sitere na W-Cu, Mo-Cu, CMC, CPC, Cu / Al / Ag-Diamond, Pin-Fins, wdg.

Ụgwọ nke ụlọ ọrụ Starshining Advanced Materials Co., Ltd.
Ike na teknụzụ na imepụta ngwaahịa niile a na-akpụ akpụ nke kachasi mma sitere na W, Mo, Ta, Nb, Re & composites dị mkpa, wdg.

Ụgwọ nke ụlọ ọrụ Redao Precision Technology Co., Ltd.
Na-agwakọta nka nka nka oyi na ahụmịhe miri emi na nhazi nkenke iji kwalite mgbasa ọkụ nke ngwaọrụ eletrọnịkị.

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Mmezu nke akụkọ ihe mere eme Redao & Fengtai na ilekiri

Ha isi mmepụta na-elekwasị anya na IGBT modul okpomọkụ dissipation ọla kọpa pin fin board / flat, Kovar stamped akụkụ, ọla kọpa stampụ akụkụ na aluminum akụkụ. Site n'ikike siri ike nke stampụ, ịgha & igwe, a na-eji ngwaahịa anyị eme ihe n'ọtụtụ ebe na nkwakọ ngwaahịa ike, antenna ọdụ ọdụ 5G, radiator IGBT na ngwa elektrọn ike ndị ọzọ.

Redao (pụtara "Thermal Conduction" na Chinese): ụlọ ọrụ na-ekpuchi ebe 28,000 m².
Fengtai (nke pụtara "Ọkụ & Udo" na Chinese): ogbako ahụ nwere oghere ala nke 3500 m2.

  • 6511354sbl
    28000 + Mpaghara ụlọ ọrụ
  • 6527532
    3500 + Mpaghara ogbako
  • 651135545j
    54 Asambodo
  • 6511355crt
    30 Ahụmahụ Y

NGWA MBELATA OKPOMỌKỤ HEATSINK na nlele

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HEATSINK na-eme nke ọma na ihe ndị na-ekpo ọkụ na-ekpo ọkụ, dị ka onye na-enye ngwọta ngwọta nke microchips okpomọkụ dissipation na nkwakọ ngwaahịa, ọ bụ ụlọ ọrụ nkà na ụzụ dị elu na-ejikọta R & D, mmepụta na electroplating nke ihe ndị dị elu, na àgwà nke ngwaahịa anyị eruola ọkwa mba ụwa. Ngwaahịa njikwa okpomọkụ microelectronic dị elu anyị kachasị elu na-ekpuchi oke niile, ejiri ya na ngwa ndakwa nri, ugboro redio, infrared, laser, sekit agbakwunyere na mpaghara ndị ọzọ. Ọtụtụ iri afọ nke ahụmahụ n'ichepụta na nkà na ụzụ na-enyere anyị aka imezu ihe ndị ahịa anyị chọrọ ma mepụta ngwaahịa ndị a na-akwa akwa nke kachasị mma.

Na ndabere nke osisi dị adị, ihe ọkụkụ ọhụrụ nke 80,000 m2 na-arụ ọrụ ugbu a site na Septemba 2023, n'ọdịnihu dị nso, anyị ga-abụ nnukwu ụlọ ọrụ mmepụta ihe nke microelectronic heat spreaders & semiconductor packaging heat sink material and part in the world.