HEATSINK

Txog Peb

Keeb kwm kev ua tiav Redao & Fengtai ntawm ib nrais muag

Lawv lub ntsiab ntau lawm tsom rau IGBT modules kub dissipation tooj liab pin fin board / tiaj phaj, Kovar stamped qhov chaw, tooj liab stamped qhov chaw thiab txhuas qhov chaw. Nrog lub peev xwm muaj zog ntawm stamping, forging & machining, peb cov khoom siv dav siv hauv cov khoom siv fais fab, 5G hauv paus chaw nres tsheb kav hlau txais xov, IGBT radiator thiab lwm yam hluav taws xob hluav taws xob.

Redao (txhais tau tias "Thermal Conduction" hauv Suav): lub Hoobkas npog thaj tsam ntawm 28,000 m².
Fengtai (txhais tau tias "hluav taws thiab kev sib haum xeeb" hauv Suav): cov kev cob qhia nyob hauv pem teb ntawm 3500 m2.

HEATSINK yog cov khoom siv hluav taws xob zoo tshaj plaws, raws li kev lees paub kev daws teeb meem ntawm microchips tshav kub dissipation thiab ntim khoom, nws yog lub tuam txhab high-tech integrating R & D, manufacturing thiab electroplating ntawm cov ntaub ntawv siab heev, thiab cov khoom zoo ntawm peb cov khoom tau mus txog thoob ntiaj teb ua theem. Peb cov khoom lag luam zoo tshaj plaws microelectronic tshav kub tswj cov khoom lag luam npog tag nrho ntau yam, dav siv hauv microwave, xov tooj cua zaus, infrared, laser, integrated circuit thiab lwm yam. Peb lub xyoo dhau los ntawm kev tsim khoom thiab thev naus laus zis ua rau peb ua tau raws li peb cov neeg siv khoom xav tau thiab tsim cov khoom tsim los ntawm cov khoom zoo tshaj plaws.

Raws li cov nroj tsuag uas twb muaj lawm, ib tsob ntoo tshiab ntawm 80,000 m2 tam sim no tau pib ua haujlwm txij lub Cuaj Hli 2023, nyob rau yav tom ntej peb yuav yog lub Hoobkas loj tshaj plaws ntawm microelectronic heat spreaders & semiconductor ntim cov khoom siv hluav taws xob thiab qhov chaw hauv ntiaj teb.