Ikhaya
Izimpumelelo zomlando I-Redao & Fengtai ngokubuka nje
Ukukhiqizwa kwabo okuyinhloko kugxile kumamojula e-IGBT okushisa iphinikhodi yephinikhodi yethusi / ipuleti eliyisicaba, izingxenye ezinesitembu se-Kovar, izingxenye ezinesitembu sethusi nezingxenye ze-aluminium. Ngamakhono aqinile okugxiviza, ukubumba nokukhiqiza, imikhiqizo yethu isetshenziswa kakhulu ekufakweni kwedivayisi yamandla, i-antenna yesiteshi sesisekelo esingu-5G, irediyetha ye-IGBT namanye ama-electronics wamandla.
I-Redao (isho ukuthi "I-Thermal Conduction" ngesiShayina): imboni ihlanganisa indawo engu-28,000 m².
I-Fengtai (isho ukuthi "Umlilo Nokuthula" ngesiShayina): ama-workshops athatha indawo eyi-3500 m2.
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28000 + Indawo Yemboni -
3500 + Indawo yokusebenzela -
54 Isitifiketi -
30 Y Isipiliyoni
I-HEATSINK ihamba phambili ezintweni zokucwilisa ukushisa, njengomnikezeli wesixazululo owaziwayo we-microchips heat dissiparation and package, iyinkampani yobuchwepheshe obuphezulu ehlanganisa i-R&D, ukukhiqiza kanye ne-electroplating yezinto eziphambili, futhi izinga lemikhiqizo yethu selifinyelele ezingeni elihamba phambili lamazwe ngamazwe. Imikhiqizo yethu esezingeni eliphezulu yokulawula ukushisa kwe-microelectronic ihlanganisa lonke uhla, esetshenziswa kabanzi kuma-microwave, amafrikhwensi omsakazo, i-infrared, i-laser, isekethe ehlanganisiwe neminye imikhakha. Amashumi eminyaka ethu okuhlangenwe nakho kwezokukhiqiza nobuchwepheshe kusenza sikwazi ukuhlangabezana nezimfuneko eziqondile zamakhasimende ethu futhi sikhiqize imikhiqizo eyenziwe ngomthungi yeqophelo eliphezulu.
Ngokwesisekelo sesitshalo esikhona, isitshalo esisha esingu-80,000 m2 manje sesiyaqala ukusebenza kusukela ngoSepthemba 2023, maduze nje sizoba yimboni enkulu kunazo zonke yama-microelectronic heat spreaders & semiconductor packaging heat sink materials kanye nezingxenye emhlabeni.