ʻO Diamond-Cu/Al/Ag Composite

Hiki ke hoʻohana ʻia nā mea hoʻohui keleawe/daimana e like me nā mea hoʻoheheʻe wela o ka hanauna e hiki mai ana i nā ʻenehana uila holomua, a ʻo ia ke kumu o ka TC kiʻekiʻe loa a hiki i ka 2200 W/(m・K) ma ke ʻano; hiki ke hoʻopili ʻia ka CTE o nā mea hui keleawe/diamania e pili kokoke i nā mea ʻāpana semiconductor chip (4-6 ppm/K); hiki i ka TC o Cu-diamond composites ke hiki i 500–900 W/(m・K) ; a paʻa ka composite i ka mahana ambient a loaʻa iā ia ka isotropic TC, ʻaʻole i kaupalena i kāna mau noi ākea.

Ua like ʻo Diamond-Al me Diamond-Cu, me ka liʻiliʻi liʻiliʻi a me ka liʻiliʻi o ka hoʻonui wela.

ʻO Ag (Silver) he kiʻekiʻe ka wela ma mua o ke keleawe, ʻo ia ka mea me ka hoʻoili wela wela kiʻekiʻe ma waena o nā metala. Hoʻopili ʻia kēia Ag a me ka pauka daimana e kā mākou ʻenehana ponoʻī e hana maikaʻi i kahi mea hou me ka conductivity thermal o 600 W/(m・K) a i ʻole.